STMicroelectronics offers its clients the competitive advantages of the PolarPAK package, with benefits including 50% thinner packages compared to the SO-8, better die protection and overall reduced system size vs. its competitors. The absence of wires connecting the silicon to the frame reduces noise on the circuit, due to the parasitic inductors produced by the bonding wires. Maximum design flexibility is obtained via the fixed footprint and pad layout, independent of the die size used, which in turn enables in higher manufacturing flexibility, as there’s no need to re-design the PCB layout when using diverse PolarPAK MOSFETs.

STMicroelectronics introduced the first PolarPAK Power MOSFETS, STK800 and STK850 in the market in 2005 and has now widely enhanced its product portfolio to include a vast range of products in the 25 to 75 volt range, with very low RDS(on) x Qg.